产品系列
产品系列
CSD97396Q4MT
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
Output Configuration : Half Bridge
Applications : Synchronous Buck Converters
Interface : PWM
Load Type : Inductive
Technology : Power MOSFET
Current - Output / Channel : 30A
Current - Peak Output : 65A
Voltage - Supply : 4.5V ~ 5.5V
Voltage - Load : 4.5V ~ 24V
Operating Temperature : -40°C ~ 150°C (TJ)
Features : Bootstrap Circuit, Diode Emulation
Fault Protection : Shoot-Through
Mounting Type : Surface Mount
Package / Case : 8-PowerVFDFN
Supplier Device Package : 8-VSON (3.5x4.5)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| PT5029LT | TI | New | 详细 | ||
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| TLV5628CN | TI | 16-PDIP | New | 详细 | |
| MSP430F412IPMR | TI | 64-LQFP (10x10) | New | 详细 | |
| TPS70930DRVR | TI | 6-SON (2x2) | New | 详细 | |
| TLC27M4BCN | TI | 14-PDIP | New | 详细 | |
| CD4059AM96 | TI | 24-SOIC | New | 详细 | |
| ADC3244IRGZT | TI | 48-VQFN (7x7) | New | 详细 | |
| LM8364BALMFX32/NOPB | TI | SOT-23-5 | New | 详细 | |
| SN74CBTLV3857DBQR | TI | 24-SSOP/QSOP | New | 详细 | |
| LP2985AITPX-2.7/NOPB | TI | 5-DSBGA | New | 详细 | |
| MSP430F155IRTDT | TI | 64-VQFN (9x9) | New | 详细 | |
| TMS320DM8147BCYE0 | TI | 684-FCBGA (23x23) | New | 详细 | |
| TPS62230DRYR | TI | 6-SON (1.45x1) | New | 详细 | |
| TPS61151DRCR | TI | 10-VSON (3x3) | New | 详细 | |
| LP38841S-0.8/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| LM3677LEX-1.82/NOPB | TI | 6-LLP (2.0x1.5) | New | 详细 | |
| TPS62821DLCR | TI | 8-VSON-HR (2x1.5) | New | 详细 | |
| SN74HC163DBRG4 | TI | 16-SSOP | New | 详细 |
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