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  • LM3209TLE-G3/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Function : Step-Up/Step-Down
    Output Configuration : Positive
    Topology : Buck-Boost
    Output Type : Adjustable
    Number of Outputs : 1
    Voltage - Input (Min) : 2.7V
    Voltage - Input (Max) : 5.5V
    Voltage - Output (Min/Fixed) : 0.6V
    Voltage - Output (Max) : 4.2V
    Current - Output : 650mA
    Frequency - Switching : 2.4MHz
    Synchronous Rectifier : Yes
    Operating Temperature : -30°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 12-WFBGA, DSBGA
    Supplier Device Package : 12-DSBGA (2x2.5)

极速报价

型号
品牌 封装 批号 查看
BQ24272RGET TI 24-VQFN (4x4) New 详细
TS5USBC400IYFPR TI 12-DSBGA New 详细
PCI4510GHK TI 209-PBGA (16x16) New 详细
SN65HVD3083EDGS TI 10-VSSOP New 详细
TPS65058RGET TI 24-VQFN (4x4) New 详细
TPD2S701QDSKRQ1 TI 10-WSON (2.5x2.5) New 详细
TPS54360BDDA TI New 详细
LM2731YMFX TI SOT-23-5 New 详细
LM4846TL/NOPB TI 25-uSMD New 详细
TPS54260QDRCRQ1 TI 10-VSON (3x3) New 详细
SN74V273-10GGM TI 100-BGA MICROSTAR (10.1x10.1) New 详细
CD74HCT163E TI 16-PDIP New 详细
UCC2819N TI 16-PDIP New 详细
REF5030AQDRQ1 TI 8-SOIC New 详细
DAC7715U TI 16-SOIC New 详细
SN74ALVCH162344DL TI 56-SSOP New 详细
AFE5808AEVM TI New 详细
SN74AS08NSR TI 14-SOP New 详细
74FCT162500CTPVCT TI 56-SSOP New 详细
SN74ALS760DWRG4 TI 20-SOIC New 详细