产品系列
LM3S1138-EQC50-A2T
- Manufacturer : Texas Instruments
Packaging : Tape & Reel (TR)
Alternate Packaging
Series : Stellaris? ARM? Cortex?-M3S 1000
Part Status : Not For New Designs
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 46
Program Memory Size : 64KB (64K x 8)
Program Memory Type : FLASH
RAM Size : 16K x 8
Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
Data Converters : A/D 8x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 105°C (TA)
Mounting Type : Surface Mount
Package / Case : 100-LQFP
Supplier Device Package : 100-LQFP (14x14)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| ADS7040IDCUR | TI | US8 | New | 详细 | |
| TPS54140ADRCT | TI | 10-VSON (3x3) | New | 详细 | |
| THVD1450D | TI | 8-SOIC | New | 详细 | |
| ISO7731FQDBQRQ1 | TI | 16-SSOP | New | 详细 | |
| PTB48600AAZ | TI | New | 详细 | ||
| MSP430F156IPMR | TI | 64-LQFP (10x10) | New | 详细 | |
| CD74HC4051M | TI | 16-SOIC | New | 详细 | |
| TPS630251YFFT | TI | 20-DSBGA | New | 详细 | |
| RDK-IDM-SBC | TI | New | 详细 | ||
| TMS320C6414TBZLZ6 | TI | 532-FCBGA (23x23) | New | 详细 | |
| TPA0222PWPG4 | TI | 24-HTSSOP | New | 详细 | |
| SN65HVD21DR | TI | 8-SOIC | New | 详细 | |
| TPS75218QPWPREP | TI | 20-HTSSOP | New | 详细 | |
| DS99R106SQ/NOPB | TI | 48-WQFN (7x7) | New | 详细 | |
| SN74AHC244PWRG4 | TI | 20-TSSOP | New | 详细 | |
| CDC5801DBQRG4 | TI | 24-SSOP/QSOP | New | 详细 | |
| 74LVC2G240DCURE4 | TI | US8 | New | 详细 | |
| BUF08821BIPWPR | TI | 20-HTSSOP | New | 详细 | |
| LM3670MF-1.5/NOPB | TI | SOT-23-5 | New | 详细 | |
| MSP430G2221IRSA16R | TI | 16-QFN (4x4) | New | 详细 |
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