产品系列

罗斌森
  • LM3S1512-IBZ25-A2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 1000
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 58
    Program Memory Size : 96KB (96K x 8)
    Program Memory Type : FLASH
    RAM Size : 64K x 8
    Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
    Data Converters : A/D 2x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 108-LFBGA
    Supplier Device Package : 108-BGA (10x10)

极速报价

型号
品牌 封装 批号 查看
TM4C1294NCPDTT3 TI 128-TQFP (14x14) New 详细
VCA8500IRGCT TI 64-VQFN (9x9) New 详细
SN74AUC1G125YZAR TI 5-DSBGA, 5-WCSP (1.4x0.9) New 详细
SN74AS874DWRE4 TI New 详细
UCC3911DP-3G4 TI 16-SOIC New 详细
TPS62088YFPR TI 6-DSBGA New 详细
CD74ACT541M96 TI 20-SOIC New 详细
DS90CR212MTD TI 48-TSSOP New 详细
BQ4010MA-85 TI 28-DIP Module (18.42x37.72) New 详细
UCC3973NG4 TI 8-PDIP New 详细
SN74ABT821ADBR TI New 详细
SN75LP196DBRE4 TI 20-SSOP New 详细
INA111BP TI 8-PDIP New 详细
UA78L09ACLPE3 TI TO-92-3 New 详细
SN74AUP2G14DSF2 TI 6-SON (1x1) New 详细
SN65HVD230QDRQ1 TI 8-SOIC New 详细
CD4077BM96 TI 14-SOIC New 详细
TPA701DGNR TI 8-MSOP-PowerPad New 详细
LM4140ACM-2.0/NOPB TI 8-SOIC New 详细
TPS60210DGS TI 10-VSSOP New 详细