产品系列
LM3S1620-IBZ25-A2
- Manufacturer : Texas Instruments
Packaging : Tray
Alternate Packaging
Series : Stellaris? ARM? Cortex?-M3S 1000
Part Status : Not For New Designs
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 25MHz
Connectivity : I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 52
Program Memory Size : 128KB (128K x 8)
Program Memory Type : FLASH
RAM Size : 32K x 8
Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 108-LFBGA
Supplier Device Package : 108-BGA (10x10)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| DS15BR400TSQ | TI | 32-WQFN (5x5) | New | 详细 | |
| LM3S1D21-IBZ80-A1 | TI | 108-BGA (10x10) | New | 详细 | |
| OPA128JM | TI | TO-99-8 | New | 详细 | |
| THS4281D | TI | 8-SOIC | New | 详细 | |
| TPL7407LADR | TI | New | 详细 | ||
| LP5551SQ/NOPB | TI | 36-WQFN (6x6) | New | 详细 | |
| OPA453FAKTWT | TI | DDPAK/TO-263-7 | New | 详细 | |
| LM73606RNPR | TI | 30-WQFN (6x4) | New | 详细 | |
| DAC7562TDSCT | TI | 10-WSON (3x3) | New | 详细 | |
| LP3966ESX-5.0 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TLC27M2AID | TI | 8-SOIC | New | 详细 | |
| AMC1100DWVR | TI | 8-SOIC | New | 详细 | |
| DRV8870DDAR | TI | 8-SO PowerPad | New | 详细 | |
| BQ24753RHDT | TI | 28-VQFN (5x5) | New | 详细 | |
| DP8573AV/NOPB | TI | 28-PLCC (11.51x11.51) | New | 详细 | |
| LP2953AIN-3.3 | TI | 16-DIP | New | 详细 | |
| SN75C3243PW | TI | 28-TSSOP | New | 详细 | |
| LM2695MHX/NOPB | TI | 14-HTSSOP | New | 详细 | |
| TMP451AIDQFT | TI | 8-WSON (2x2) | New | 详细 | |
| TMP75AQDGKRQ1 | TI | 8-VSSOP | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com