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  • LM3S1635-IBZ50-A2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 1000
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : I2C, IrDA, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 56
    Program Memory Size : 128KB (128K x 8)
    Program Memory Type : FLASH
    RAM Size : 32K x 8
    Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
    Data Converters : A/D 4x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 108-LFBGA
    Supplier Device Package : 108-BGA (10x10)

极速报价

型号
品牌 封装 批号 查看
TP3406N/NOPB TI New 详细
SN74HCT273PWR TI New 详细
TRF7961RHBT TI 32-VQFN (5x5) New 详细
S5LS10206ASPGEQQ1 TI 144-LQFP (20x20) New 详细
TS3USB31ERSER TI 8-UQFN (1.5x1.5) New 详细
TLV70018EVM-503 TI New 详细
BQ20Z70PW-V110G4 TI 20-TSSOP New 详细
LP38842T-1.5 TI TO-220-5 New 详细
TPS76933DBVR TI SOT-23-5 New 详细
LP3970SQ-35/NOPB TI 48-WQFN (7x7) New 详细
SN74LVC1GX04DRLR TI 6-SOT New 详细
UCC2946TPWRQ1 TI 8-TSSOP New 详细
TPS65055EVM-258 TI New 详细
LMP2234BMAX/NOPB TI 14-SOIC New 详细
SN74HC161N TI 16-PDIP New 详细
SN74LVCZ240APW TI 20-TSSOP New 详细
TPS3851G30SQDRBRQ1 TI 8-SON (3x3) New 详细
SN75LBC170DW TI 20-SOIC New 详细
SN74AUP3G17DCUR TI US8 New 详细
MSP-FET430U40A TI New 详细