产品系列
LM3S1637-IBZ50-A2
- Manufacturer : Texas Instruments
Packaging : Tray
Alternate Packaging
Series : Stellaris? ARM? Cortex?-M3S 1000
Part Status : Not For New Designs
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 43
Program Memory Size : 128KB (128K x 8)
Program Memory Type : FLASH
RAM Size : 32K x 8
Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
Data Converters : A/D 4x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 108-LFBGA
Supplier Device Package : 108-BGA (10x10)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| CD74AC157M | TI | 16-SOIC | New | 详细 | |
| TAS5720A-Q1EVM | TI | New | 详细 | ||
| DLP7000FLP | TI | 203-LCCC (40.64x31.75) | New | 详细 | |
| BQ4016YMC-70 | TI | 36-DIP Module (18.42x52.96) | New | 详细 | |
| LP3907SQ-JXQXEV/NOPB | TI | New | 详细 | ||
| DS90UB936TRGZRQ1 | TI | 48-VQFN-EP (7x7) | New | 详细 | |
| ADS1247EVM-PDK | TI | New | 详细 | ||
| BQ29716DSER | TI | New | 详细 | ||
| MSP430F5501IRGZR | TI | 48-VQFN (7x7) | New | 详细 | |
| SN74S175NSR | TI | New | 详细 | ||
| LM35DZ/LFT4 | TI | TO-92-3 | New | 详细 | |
| ADS8322YB/250 | TI | 32-TQFP (5x5) | New | 详细 | |
| TPS75818KTTT | TI | DDPAK/TO-263-5 | New | 详细 | |
| TAS5015PFBG4 | TI | 48-TQFP (7x7) | New | 详细 | |
| PCA9554ARGTR | TI | 16-QFN (3x3) | New | 详细 | |
| TPS5450MDDAREP | TI | 8-SO PowerPad | New | 详细 | |
| SN65ELT23DGK | TI | 8-VSSOP | New | 详细 | |
| SN74LVC1G18YZAR | TI | 6-DSBGA | New | 详细 | |
| LM4890MMX/NOPB | TI | 8-VSSOP | New | 详细 | |
| TMS320C6655CZHA | TI | 625-FCBGA (21x21) | New | 详细 |
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