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  • LM3S2601-IBZ50-A2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 2000
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 60
    Program Memory Size : 128KB (128K x 8)
    Program Memory Type : FLASH
    RAM Size : 32K x 8
    Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 108-LFBGA
    Supplier Device Package : 108-BGA (10x10)

极速报价

型号
品牌 封装 批号 查看
TPS2062ADR TI 8-SOIC New 详细
TLV71209DBVT TI SOT-23-5 New 详细
TPS73433TDDCRQ1 TI SOT-23-5 New 详细
SN74LVC2G08YZPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
MSP430FG439IZCAR TI 113-NFBGA (7x7) New 详细
PCA9543AD TI 14-SOIC New 详细
TL4050A41IDCKR TI SC-70-5 New 详细
TMS320DM8148BCYE0 TI 684-FCBGA (23x23) New 详细
TPS7A8300ARGWT TI 20-VQFN (5x5) New 详细
TMS320C5505AZCH12 TI 196-NFBGA (10x10) New 详细
TPS659110A2ZRC TI 98-BGA Microstar JR New 详细
LMK61PD0A2-SIAT TI New 详细
LP2981IM5-3.2/NOPB TI SOT-23-5 New 详细
LP2989IMM-3.3/NOPB TI 8-VSSOP New 详细
TLC272BIDR TI 8-SOIC New 详细
LM3691TL-0.75/NOPB TI 6-DSBGA (1.5x1.3) New 详细
LP3881ESX-1.8 TI DDPAK/TO-263-5 New 详细
SN74LVC1G07DBVRG4 TI SOT-23-5 New 详细
LM3658SD-A/NOPB TI 10-WSON (3x3) New 详细
TLV2781IDR TI 8-SOIC New 详细