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  • LM3S2601-IBZ50-A2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 2000
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 60
    Program Memory Size : 128KB (128K x 8)
    Program Memory Type : FLASH
    RAM Size : 32K x 8
    Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 108-LFBGA
    Supplier Device Package : 108-BGA (10x10)

极速报价

型号
品牌 封装 批号 查看
SN65DP141RLJT TI 38-WQFN (5x7) New 详细
ADC0820CCN/NOPB TI 20-DIP New 详细
UCC2839D TI 14-SOIC New 详细
SN74LVCH244ANSR TI 20-SO New 详细
UCC27322DGNR TI 8-MSOP-PowerPad New 详细
LM4040CIM3X-4.1 TI SOT-23-3 New 详细
LMH6714MA TI 8-SOIC New 详细
SN74LVC1G126DBVR TI SOT-23-5 New 详细
LP3907SQ-PXPP/NOPB TI 24-WQFN (4x4) New 详细
LM2832XMYX TI 8-MSOP-PowerPad New 详细
TPS3839G25DBZR TI SOT-23-3 New 详细
LM386N-1 TI 8-PDIP New 详细
CD74HC280E TI 14-PDIP New 详细
LM3S1608-IBZ50-A2 TI 108-BGA (10x10) New 详细
LM3671MFX-2.8/NOPB TI SOT-23-5 New 详细
TPS72718YFFT TI 4-DSBGA (1x1) New 详细
AM5K2E04XABDA4 TI 1089-FCBGA (27x27) New 详细
TLC075IN TI 16-PDIP New 详细
TPS54383EVM TI New 详细
BQ27500DRZR-V100 TI 12-SON (2.5x4) New 详细