产品系列

罗斌森
  • LM3S300-EGZ25-C2T

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Series : Stellaris? ARM? Cortex?-M3S 300
    Part Status : Discontinued at Digi-Key
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 25MHz
    Connectivity : I2C, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 36
    Program Memory Size : 16KB (16K x 8)
    Program Memory Type : FLASH
    RAM Size : 4K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
SN74S08NSRE4 TI 14-SOP New 详细
CD74HC574E TI New 详细
ADS6143EVM TI New 详细
TLE2024AQDWRQ1 TI 16-SOIC New 详细
LP3961ESX-1.8 TI DDPAK/TO-263-5 New 详细
TMS320C6747BZKBT3 TI 256-BGA (17x17) New 详细
UCC3802DTR TI 8-SOIC New 详细
TPS54386TPWPRQ1 TI 14-HTSSOP New 详细
MSP430G2231IRSAQ1 TI 16-QFN (4x4) New 详细
SN74AHC125RGYR TI 14-VQFN (3.5x3.5) New 详细
SN74LVC1G18DCKR TI SC-70-6 New 详细
DP83843BVJE TI 80-MQFP New 详细
TPS40091RHDR TI 28-VQFN (5x5) New 详细
SN74ABT18640DLR TI 56-SSOP New 详细
TSB43AB23PDT TI 128-TQFP (14x14) New 详细
SN74LVC2G240DCUR TI US8 New 详细
TPS75325QPWPREP TI 20-HTSSOP New 详细
LP5562TME/NOPB TI 12-DSBGA New 详细
OPA735AIDBVR TI SOT-23-5 New 详细
SN74GTLP21395PWE4 TI 20-TSSOP New 详细