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LM3S1911-IBZ50-A2T
- Manufacturer : Texas Instruments
Packaging : Tape & Reel (TR)
Alternate Packaging
Series : Stellaris? ARM? Cortex?-M3S 1000
Part Status : Not For New Designs
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 60
Program Memory Size : 256KB (256K x 8)
Program Memory Type : FLASH
RAM Size : 64K x 8
Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 108-LFBGA
Supplier Device Package : 108-BGA (10x10)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| MSP430F2122IRTVT | TI | 32-WQFN (5x5) | New | 详细 | |
| MSP430FE4252IPMR | TI | 64-LQFP (10x10) | New | 详细 | |
| TLV2344ID | TI | 14-SOIC | New | 详细 | |
| AMC1200BDUBR | TI | 8-SOP | New | 详细 | |
| LP38503TJ-ADJ/NOPB | TI | TO-263-5 Thin | New | 详细 | |
| SN74HC4040PW | TI | 16-TSSOP | New | 详细 | |
| ADC12H034CIMSA/NOPB | TI | 24-SSOP | New | 详细 | |
| LM22670EVAL | TI | New | 详细 | ||
| ADC081S021CISD | TI | 6-WSON (2.2x2.5) | New | 详细 | |
| LMV324SIDRG4 | TI | 16-SOIC | New | 详细 | |
| LM3670MFX-2.5/NOPB | TI | SOT-23-5 | New | 详细 | |
| ULN2003APW | TI | 16-TSSOP | New | 详细 | |
| SN74LVCH244ADGVR | TI | 20-TVSOP | New | 详细 | |
| UC3906DWG4 | TI | 16-SOIC | New | 详细 | |
| TPS65051RSMT | TI | 32-VQFN (4x4) | New | 详细 | |
| TLC2933AIPW | TI | 14-TSSOP | New | 详细 | |
| MSP430G2113IPW20 | TI | 20-TSSOP | New | 详细 | |
| SN74LVC574ADW | TI | New | 详细 | ||
| ADS8867IDGSR | TI | 10-VSSOP | New | 详细 | |
| PCA9515ADGKT | TI | 8-VSSOP | New | 详细 |
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