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  • LM3S1918-EQC50-A2T

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 1000
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : I2C, IrDA, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 52
    Program Memory Size : 256KB (256K x 8)
    Program Memory Type : FLASH
    RAM Size : 64K x 8
    Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 100-LQFP
    Supplier Device Package : 100-LQFP (14x14)

极速报价

型号
品牌 封装 批号 查看
BQ29703DSER TI 6-WSON (1.5x1.5) New 详细
SN74LVC16373ADGVR TI 48-TVSOP New 详细
SN74LV4052ARGYR TI 16-VQFN (4x3.5) New 详细
DAC7811IDGSR TI 10-VSSOP New 详细
TS3L110PW TI 16-TSSOP New 详细
MSP430G2452IPW14R TI 14-TSSOP New 详细
LP2951ACMX/NOPB TI 8-SOIC New 详细
CD74HC354E TI 20-PDIP New 详细
TRF3710IRGZT TI 48-VQFN (7x7) New 详细
TLC374IN TI 14-PDIP New 详细
INA125U TI 16-SOIC New 详细
LM3S610-EGZ50-C2T TI 48-VQFN (7x7) New 详细
CSD87501L TI 10-Picostar (3.37x1.47) New 详细
LP3961ESX-1.8 TI DDPAK/TO-263-5 New 详细
LM2591HVSX-3.3 TI DDPAK/TO-263-5 New 详细
SN75LVCP600DRFR TI 8-WSON (2x2) New 详细
UCC383TD-ADJ TI DDPAK/TO-263-5 New 详细
SN74LVC1G08MDCKREP TI SC-70-5 New 详细
DS90CR581MTD TI 56-TSSOP New 详细
MSP430FG477IZQW TI 113-BGA Microstar Junior (7x7) New 详细