产品系列
LM3S1918-IBZ50-A2
- Manufacturer : Texas Instruments
Packaging : Tray
Alternate Packaging
Series : Stellaris? ARM? Cortex?-M3S 1000
Part Status : Not For New Designs
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 52
Program Memory Size : 256KB (256K x 8)
Program Memory Type : FLASH
RAM Size : 64K x 8
Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
Data Converters : A/D 8x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 108-LFBGA
Supplier Device Package : 108-BGA (10x10)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| DAC8830ICDT | TI | 8-SOIC | New | 详细 | |
| INA2126EA/250 | TI | 16-SSOP | New | 详细 | |
| X66AK2H06AAW2 | TI | 1517-FCBGA (40x40) | New | 详细 | |
| SN64BCT244DWRG4 | TI | 20-SOIC | New | 详细 | |
| LP2967ITP-2833/NOPB | TI | 8-μSMD (1.41x1.95) | New | 详细 | |
| TLV70218DBVT | TI | SOT-23-5 | New | 详细 | |
| LMH6619MA/NOPB | TI | 8-SOIC | New | 详细 | |
| CLVTH32244IGKEREP | TI | 96-LFBGA (13.5x5.5) | New | 详细 | |
| LM2575HVS-12/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| BQ20Z70PWR-V110 | TI | 20-TSSOP | New | 详细 | |
| LM317LILP | TI | TO-92-3 | New | 详细 | |
| LP3856ESX-2.5 | TI | DDPAK/TO-263-5 | New | 详细 | |
| AVCE6467TZUTL1 | TI | 529-FCBGA (19x19) | New | 详细 | |
| TPS79147DBVT | TI | SOT-23-5 | New | 详细 | |
| ADC12D1800CIUT/NOPB | TI | 292-BGA (27x27) | New | 详细 | |
| LMH6515EVAL | TI | New | 详细 | ||
| DS90UB928QEVM | TI | New | 详细 | ||
| CD4078BNSR | TI | 14-SOP | New | 详细 | |
| LT1014CN | TI | 14-PDIP | New | 详细 | |
| TSB43AB23IPDTEP | TI | 128-TQFP (14x14) | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com