产品系列
LM3S1968-IBZ50-A2
- Manufacturer : Texas Instruments
Packaging : Tray
Alternate Packaging
Series : Stellaris? ARM? Cortex?-M3S 1000
Part Status : Not For New Designs
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 52
Program Memory Size : 256KB (256K x 8)
Program Memory Type : FLASH
RAM Size : 64K x 8
Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
Data Converters : A/D 8x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 108-LFBGA
Supplier Device Package : 108-BGA (10x10)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM2936HVMAX-5.0 | TI | 8-SOIC | New | 详细 | |
| LM21212MHE-1/NOPB | TI | 20-HTSSOP | New | 详细 | |
| CC1000PWR | TI | New | 详细 | ||
| 74ALVTH32373ZKER | TI | 96-PBGA MICROSTAR (13.6x5.6) | New | 详细 | |
| LM78S40CN | TI | 16-PDIP | New | 详细 | |
| SN74LV32ADBR | TI | 14-SSOP | New | 详细 | |
| OPA2322SAIDGSR | TI | 10-VSSOP | New | 详细 | |
| FCT162501CTPACTG4 | TI | 56-TSSOP | New | 详细 | |
| LMC6032IMX | TI | 8-SOIC | New | 详细 | |
| LP3966ES-5.0/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| SN74LVC8T245RHLR | TI | 24-VQFN (5.5x3.5) | New | 详细 | |
| TPS61080EVM-147 | TI | New | 详细 | ||
| TMS320DM365ZCED30 | TI | 338-NFBGA (13x13) | New | 详细 | |
| CRANE | TI | New | 详细 | ||
| SN74BCT623DWRE4 | TI | 20-SOIC | New | 详细 | |
| LP2985AIBP-4.0 | TI | 5-μSMD (0.93x1.11) | New | 详细 | |
| TLV5638ID | TI | 8-SOIC | New | 详细 | |
| LP3995ILD-3.0/NOPB | TI | 6-WSON (2.92x3.29) | New | 详细 | |
| TLC59208FIRGYR | TI | 16-VQFN (4x4) | New | 详细 | |
| LM4121IM5X-ADJ | TI | SOT-23-5 | New | 详细 |
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