产品系列

罗斌森
  • LM3S2110-EQC25-A2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 2000
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 25MHz
    Connectivity : CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 40
    Program Memory Size : 64KB (64K x 8)
    Program Memory Type : FLASH
    RAM Size : 16K x 8
    Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 100-LQFP
    Supplier Device Package : 100-LQFP (14x14)

极速报价

型号
品牌 封装 批号 查看
OPA377AIDCKR TI SC-70-5 New 详细
LM95241CIMM-1 TI 8-VSSOP New 详细
AM3351BZCE30 TI 298-NFBGA (13x13) New 详细
TL331QDBVRQ1 TI SOT-23-5 New 详细
ADS62P28IRGCT TI 64-VQFN (9x9) New 详细
LMC7211AIM TI 8-SOIC New 详细
LMH2180SDE/NOPB TI 8-WSON (3x3) New 详细
CD74HCT137E TI 16-PDIP New 详细
LM3S5732-IQR50-A0 TI 64-LQFP (10x10) New 详细
LMG3411R070RWHT TI 32-VQFN (8x8) New 详细
BQ24032RHLR TI 20-VQFN (3.5x4.5) New 详细
LM8272MM/NOPB TI 8-VSSOP New 详细
TLV2434ID TI 14-SOIC New 详细
SN74AVC4T245PWR TI 16-TSSOP New 详细
TLE2426MD TI 8-SOIC New 详细
LP2952IN-3.3/NOPB TI 14-DIP New 详细
TLC7226IN TI 20-PDIP New 详细
TSC2013QRSARQ1 TI 16-QFN (4x4) New 详细
SN74LV573ATDGVRG4 TI 20-TVSOP New 详细
TPS3307-18DGNR TI 8-MSOP-PowerPad New 详细