产品系列

罗斌森
  • LM3S300-IQN25-C2T

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 300
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 25MHz
    Connectivity : I2C, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 36
    Program Memory Size : 16KB (16K x 8)
    Program Memory Type : FLASH
    RAM Size : 4K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
TPS68401C4YFFR TI 20-DSBGA New 详细
LM2903DG4 TI 8-SOIC New 详细
SN74LVCC3245ADW TI 24-SOIC New 详细
LMR16006YQ5DDCTQ1 TI TSOT-23-6 New 详细
TL16C550CPTR TI 48-LQFP (7x7) New 详细
LM3S9G97-IBZ80-A1T TI 108-BGA (10x10) New 详细
LM2694MTX TI 14-TSSOP New 详细
LM3814MX-7.0 TI 8-SOIC New 详细
LM25115AMTX TI 16-TSSOP New 详细
OPA187IDBVR TI SOT-23-5 New 详细
SN74LS10NSR TI 14-SOP New 详细
AM3357BZCZD60 TI 324-NFBGA(15x15) New 详细
CD74HCT40105MT TI 16-SOIC New 详细
SN74HC373NS TI New 详细
LM4132CMF-2.5/NOPB TI SOT-23-5 New 详细
LM2940T-5.0/LF08 TI TO-220-3 New 详细
TPS659121YFFR TI 81-DSBGA (3.6x3.6) New 详细
VFC32KP TI 14-PDIP New 详细
CD74HCT40103M TI 16-SOIC New 详细
BQ27426YZFR TI 9-DSBGA New 详细