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  • LM3S300-IQN25-C2T

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 300
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 25MHz
    Connectivity : I2C, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 36
    Program Memory Size : 16KB (16K x 8)
    Program Memory Type : FLASH
    RAM Size : 4K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
TAS5612PHDR TI 64-HTQFP (14x14) New 详细
BQ24072TRGTR TI 16-QFN (3x3) New 详细
BQ29717DSER TI New 详细
SN74HC165PWR TI 16-TSSOP New 详细
SN74AUC2G86DCTR TI SM8 (SSOP) New 详细
TPA0112PWP TI 24-HTSSOP New 详细
SN74ACT7807-40PAG TI 64-TQFP (10x10) New 详细
SM32C6712DGDPA16EP TI 272-BGA (27x27) New 详细
PTH12050LAH TI New 详细
LM2798MM-2.0/NOPB TI 10-VSSOP New 详细
LM385LPR-2-5 TI TO-92-3 New 详细
TLV2783CD TI 14-SOIC New 详细
LM3S5K31-IBZ80-C3T TI 108-BGA (10x10) New 详细
LP3881ES-1.8/NOPB TI DDPAK/TO-263-5 New 详细
TRS3232IDBG4 TI 16-SSOP New 详细
LM2577T-12/LF03 TI TO-220-5 New 详细
CC2620F128RSMR TI 32-VQFN (4x4) New 详细
LM7812S/NOPB TI DDPAK/TO-263-3 New 详细
MAX3222EIPWR TI 20-TSSOP New 详细
LM2991SX TI DDPAK/TO-263-5 New 详细