产品系列
LM3S308-IQN25-C2
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Stellaris? ARM? Cortex?-M3S 300
Part Status : Not For New Designs
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 25MHz
Connectivity : I2C, Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 28
Program Memory Size : 16KB (16K x 8)
Program Memory Type : FLASH
RAM Size : 4K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Data Converters : A/D 8x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-LQFP
Supplier Device Package : 48-LQFP (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| ISO7740QDBQQ1 | TI | 16-SSOP | New | 详细 | |
| SN74F2373N | TI | 20-PDIP | New | 详细 | |
| CD74HCT75M | TI | 16-SOIC | New | 详细 | |
| UCD3138RGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| LM2671N-ADJ/NOPB | TI | 8-PDIP | New | 详细 | |
| TAS5508CPAGR | TI | 64-TQFP (10x10) | New | 详细 | |
| TMP513EVM | TI | New | 详细 | ||
| CD74HCT573E | TI | 20-PDIP | New | 详细 | |
| LM2585SX-5.0/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| DRV8873HEVM | TI | New | 详细 | ||
| LM5001SD | TI | 8-WSON (4x4) | New | 详细 | |
| OMAPL138BGWTMEP | TI | 361-NFBGA (16x16) | New | 详细 | |
| OPA4180IPW | TI | 14-TSSOP | New | 详细 | |
| UCC2800PWTR | TI | 8-TSSOP | New | 详细 | |
| BQ29410DCTRG4 | TI | SM8 (SSOP) | New | 详细 | |
| TLV2254ID | TI | 14-SOIC | New | 详细 | |
| 74ACT11245PWE4 | TI | 24-TSSOP | New | 详细 | |
| LM3402HVMRX/NOPB | TI | 8-SO PowerPad | New | 详细 | |
| SN74GTL16612DLR | TI | 56-SSOP | New | 详细 | |
| CD4034BNSRE4 | TI | 24-SO | New | 详细 |
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