产品系列
LM3S310-EGZ25-C2
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Stellaris? ARM? Cortex?-M3S 300
Part Status : Discontinued at Digi-Key
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 25MHz
Connectivity : Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 36
Program Memory Size : 16KB (16K x 8)
Program Memory Type : FLASH
RAM Size : 4K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Oscillator Type : Internal
Operating Temperature : -40°C ~ 105°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| THS7368EVM | TI | New | 详细 | ||
| TAS2552EVM | TI | New | 详细 | ||
| LM335M/NOPB | TI | 8-SOIC | New | 详细 | |
| TPA6141A2YFFR | TI | 16-DSBGA (1.56x1.56) | New | 详细 | |
| TPS92518PWPR | TI | 24-HTSSOP | New | 详细 | |
| CD74HC563M | TI | 20-SOIC | New | 详细 | |
| INA101KU | TI | 16-SOIC | New | 详细 | |
| TLV2313IDR | TI | 8-SOIC | New | 详细 | |
| LM2674LDX-5.0 | TI | 16-WSON (5x5) | New | 详细 | |
| LM3S9G97-IBZ80-A1 | TI | 108-BGA (10x10) | New | 详细 | |
| BQ27510DRZR-G1 | TI | 12-SON (2.5x4) | New | 详细 | |
| PCI2050PDV | TI | 208-LQFP | New | 详细 | |
| LP2981IM5X-3.6/NOPB | TI | SOT-23-5 | New | 详细 | |
| PGA460TPWQ1 | TI | 16-TSSOP | New | 详细 | |
| PCM56P-L | TI | 16-PDIP | New | 详细 | |
| ADS54RF63EVM | TI | New | 详细 | ||
| LMV226TLX/NOPB | TI | 4-DSBGA (1x1) | New | 详细 | |
| BQ24153AEVM-697 | TI | New | 详细 | ||
| CD74HC137PW | TI | 16-TSSOP | New | 详细 | |
| TAS5733LDCAR | TI | 48-HTSSOP | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com