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  • LM3S315-IQN25-C2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 300
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 25MHz
    Connectivity : Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 32
    Program Memory Size : 16KB (16K x 8)
    Program Memory Type : FLASH
    RAM Size : 4K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Data Converters : A/D 4x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
AM1808BZCED4 TI 361-NFBGA (13x13) New 详细
VSP01M02ZWD TI 100-BGA (7x7) New 详细
LF353P TI 8-PDIP New 详细
BQ4010MA-200 TI 28-DIP Module (18.42x37.72) New 详细
LM3433SQ/NOPB TI 24-WQFN (4x4) New 详细
TLE2071AQDRQ1 TI 8-SOIC New 详细
SN74LS266NSR TI 14-SOP New 详细
TPS7B6933QDBVRQ1 TI SOT-23-5 New 详细
SN74CBT6800CPWR TI 24-TSSOP New 详细
TUSB8044RGCR TI 64-VQFN (9x9) New 详细
SN74AUP1G79DBVT TI New 详细
SN74CB3Q3257RGYR TI 16-VQFN (4x4) New 详细
SN74AUP1G04YFPR TI 4-DSBGA (0.8x0.8) New 详细
LP2985AITP-2.6/NOPB TI 5-DSBGA New 详细
LP3872EMPX-2.5 TI SOT-223-5 New 详细
UC3573N TI 8-PDIP New 详细
TLE2021ACD TI 8-SOIC New 详细
CD74FCT374M96 TI New 详细
TMS320F280220DAS TI 38-TSSOP New 详细
DRV8308RHAR TI 40-VQFN (6x6) New 详细