产品系列
LM3S317-EGZ25-C2
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Stellaris? ARM? Cortex?-M3S 300
Part Status : Discontinued at Digi-Key
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 25MHz
Connectivity : Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 30
Program Memory Size : 16KB (16K x 8)
Program Memory Type : FLASH
RAM Size : 4K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Data Converters : A/D 6x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 105°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| ADS8383IBPFBRG4 | TI | 48-TQFP (7x7) | New | 详细 | |
| TPSM84205EAB | TI | 3-SIP Module | New | 详细 | |
| SN74LVC827APW | TI | 24-TSSOP | New | 详细 | |
| DIT4192IPW | TI | 28-TSSOP | New | 详细 | |
| ADC12D1800RFIUT/NOPB | TI | 292-BGA (27x27) | New | 详细 | |
| LMX2364TM/NOPB | TI | 24-TSSOP | New | 详细 | |
| ADC104S101CIMMX/NOPB | TI | 10-VSSOP | New | 详细 | |
| LM25011MY/NOPB | TI | 10-MSOP-EP | New | 详细 | |
| SN74AUP1G07YFPR | TI | 4-DSBGA (0.8x0.8) | New | 详细 | |
| SN74LV139ANSR | TI | 16-SO | New | 详细 | |
| PCM1704U | TI | 20-SO | New | 详细 | |
| INA103KP | TI | 16-PDIP | New | 详细 | |
| TMP141AIDBVTG4 | TI | SOT-23-6 | New | 详细 | |
| THS8200IPFPEP | TI | 80-HTQFP (12x12) | New | 详细 | |
| TL034ID | TI | 14-SOIC | New | 详细 | |
| LP3963ET-1.8/NOPB | TI | TO-220-5 | New | 详细 | |
| OMAP3515DCBB | TI | 515-POP-FCBGA (12x12) | New | 详细 | |
| LM5150RUMHDEVM | TI | New | 详细 | ||
| TIBPAL20R6-15CNT | TI | 24-PDIP | New | 详细 | |
| LP3874ESX-1.8 | TI | DDPAK/TO-263-5 | New | 详细 |
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