产品系列
LM3S608-EGZ50-C2
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Stellaris? ARM? Cortex?-M3S 600
Part Status : Discontinued at Digi-Key
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : I2C, Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 28
Program Memory Size : 32KB (32K x 8)
Program Memory Type : FLASH
RAM Size : 8K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Data Converters : A/D 8x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 105°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
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| TMS320VC5407GGU | TI | 144-BGA MICROSTAR (12x12) | New | 详细 | |
| LMC6482IMX/NOPB | TI | 8-SOIC | New | 详细 | |
| LMP7709MT/NOPB | TI | 14-TSSOP | New | 详细 | |
| TLV62568PEVM-884 | TI | New | 详细 | ||
| SN74AC240DW | TI | 20-SOIC | New | 详细 | |
| ADS8382IRHPT | TI | 28-VQFN-EP (6x6) | New | 详细 | |
| TLV320A1109PBSRG4 | TI | 32-TQFP (5x5) | New | 详细 | |
| SN74LVC162244ADGGR | TI | 48-TSSOP | New | 详细 | |
| SN74AUC1G08YEAR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 详细 | |
| SN74CB3Q32245GKER | TI | 96-LFBGA (13.5x5.5) | New | 详细 | |
| REG102GA-2.5/2K5G4 | TI | SOT-223-6 | New | 详细 | |
| LM555CN/NOPB | TI | 8-PDIP | New | 详细 | |
| LM2673S-ADJ/NOPB | TI | DDPAK/TO-263-7 | New | 详细 | |
| DAC5670IGDJ | TI | 252-BGA | New | 详细 | |
| ADC121C021QIMKX/NOPB | TI | TSOT-23-6 | New | 详细 | |
| TS321IDR | TI | 8-SOIC | New | 详细 | |
| LM2587T-12/NOPB | TI | TO-220-5 | New | 详细 |
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