产品系列
LM3S612-IGZ50-C2
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Stellaris? ARM? Cortex?-M3S 600
Part Status : Discontinued at Digi-Key
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : I2C, Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 34
Program Memory Size : 32KB (32K x 8)
Program Memory Type : FLASH
RAM Size : 8K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Data Converters : A/D 2x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TMS320DM642AZNZA5 | TI | 548-FCBGA (27x27) | New | 详细 | |
| MSP430G2313IPW28R | TI | 28-TSSOP | New | 详细 | |
| SCAN25100TYAX/NOPB | TI | 100-HTQFP (14x14) | New | 详细 | |
| LP3961EMP-3.3/NOPB | TI | SOT-223-5 | New | 详细 | |
| TLC549CDG4 | TI | 8-SOIC | New | 详细 | |
| TPS53318DQPR | TI | 22-LSON-CLIP (6x5) | New | 详细 | |
| SN74AUP1G58DRYR | TI | 6-SON (1.45x1) | New | 详细 | |
| BQ4013YMA-70N | TI | 32-DIP Module (18.42x42.8) | New | 详细 | |
| LM2670SD-3.3 | TI | 14-VSON (5x6) | New | 详细 | |
| TS3USB221ERSER | TI | 10-UQFN (2.0x1.5) | New | 详细 | |
| DRV777PWR | TI | 16-TSSOP | New | 详细 | |
| SN74LS266DRE4 | TI | 14-SOIC | New | 详细 | |
| BQ24163RGET | TI | 24-VQFN (4x4) | New | 详细 | |
| AMC7812BSRGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| TAS5613PHD2EVM | TI | New | 详细 | ||
| LM2903PSR | TI | 8-SO | New | 详细 | |
| CD74ACT574M96 | TI | New | 详细 | ||
| ADS8328IBRSAT | TI | 16-QFN (4x4) | New | 详细 | |
| SN74AS874DWR | TI | New | 详细 | ||
| SN74LVCH16543ADGVR | TI | 56-TVSOP | New | 详细 |
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