产品系列
LM3S613-IGZ50-C2
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Stellaris? ARM? Cortex?-M3S 600
Part Status : Discontinued at Digi-Key
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : I2C, Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 32
Program Memory Size : 32KB (32K x 8)
Program Memory Type : FLASH
RAM Size : 8K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Data Converters : A/D 4x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| PTB48510BAH | TI | New | 详细 | ||
| UCC5639FQPTRG4 | TI | 48-LQFP (7x7) | New | 详细 | |
| TMS320C6414TBZLZ8 | TI | 532-FCBGA (23x23) | New | 详细 | |
| CD40117BNSRG4 | TI | 14-SOP | New | 详细 | |
| TPS622314DRYT | TI | 6-SON (1.45x1) | New | 详细 | |
| LM2678SX-3.3/NOPB | TI | DDPAK/TO-263-7 | New | 详细 | |
| PCM1702U-K/2K | TI | 20-SO | New | 详细 | |
| TL432BQDBVT | TI | SOT-23-5 | New | 详细 | |
| LMP7709MAX/NOPB | TI | 14-SOIC | New | 详细 | |
| SN74AVC4T774PW | TI | 16-TSSOP | New | 详细 | |
| LM6142BIM/NOPB | TI | 8-SOIC | New | 详细 | |
| SN74HC573APWT | TI | 20-TSSOP | New | 详细 | |
| SN74ABT16827DLR | TI | 56-SSOP | New | 详细 | |
| CDCLVC1108PWR | TI | 16-TSSOP | New | 详细 | |
| VSP2254ZSJG1 | TI | 96-PBGA MICROSTAR JUNIOR (9x9) | New | 详细 | |
| THVD1512DGSR | TI | 10-VSSOP | New | 详细 | |
| TPS2047DR | TI | 16-SOIC | New | 详细 | |
| TS3A27518EZQSR | TI | 24-BGA MICROSTAR JUNIOR (3x3) | New | 详细 | |
| BQ24180EVM | TI | New | 详细 | ||
| TPS61253YFFR | TI | 9-DSBGA (1.2x1.3) | New | 详细 |
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