产品系列

罗斌森
  • LM3S615-IQN50-C2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 600
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : I2C, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 34
    Program Memory Size : 32KB (32K x 8)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Data Converters : A/D 2x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
TL431BIDBZR TI SOT-23-3 New 详细
SN74LVC1G17MDBVREP TI SOT-23-5 New 详细
LMS36555QRNLTQ1 TI 22-VQFN-HR (5x4) New 详细
TLC25L4ACD TI 14-SOIC New 详细
SN74LVC3G17DCURG4 TI US8 New 详细
TLV76033DBZR TI SOT-23-3 New 详细
LMZ31506HEVM-692 TI New 详细
TS3DV621RUAR TI 42-WQFN (3.5x9.0) New 详细
PCM1730E TI 28-SSOP New 详细
MSP430F47127IPZR TI 100-LQFP (14x14) New 详细
LP2985IBP-3.3 TI 5-μSMD (0.93x1.11) New 详细
CY74FCT574CTQCT TI New 详细
DRV135UA TI 8-SOIC New 详细
DS99R106SQX/NOPB TI 48-WQFN (7x7) New 详细
LMH6722MA TI 14-SOIC New 详细
SN74LVC1G06YZTR TI 4-DSBGA (0.9x0.9) New 详细
DDC1128ZKLT TI 192-NFBGA (9x9) New 详细
LP3961ES-1.8/NOPB TI DDPAK/TO-263-5 New 详细
LM5165QDRCTQ1 TI 10-VSON (3x3) New 详细
OPA551PA TI 8-PDIP New 详细