产品系列
LM3S617-EGZ50-C2T
- Manufacturer : Texas Instruments
Packaging : Tape & Reel (TR)
Series : Stellaris? ARM? Cortex?-M3S 600
Part Status : Discontinued at Digi-Key
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 30
Program Memory Size : 32KB (32K x 8)
Program Memory Type : FLASH
RAM Size : 8K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Data Converters : A/D 6x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 105°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| AMC1303E0520DWV | TI | 8-SOIC | New | 详细 | |
| LM2675M-ADJ/NOPB | TI | 8-SOIC | New | 详细 | |
| LMV221EVAL/NOPB | TI | New | 详细 | ||
| LP2985IM5X-135 | TI | SOT-23-5 | New | 详细 | |
| SN74ABT125PWR | TI | 14-TSSOP | New | 详细 | |
| SN74LVC2G17YZAR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| LMH6505MAX/NOPB | TI | 8-SOIC | New | 详细 | |
| LM2592HVS-5.0/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| TPS61132PWR | TI | 16-TSSOP | New | 详细 | |
| DAC5675MPHPREP | TI | 48-HTQFP (7x7) | New | 详细 | |
| MSP430G2211IRSAQ1 | TI | 16-QFN (4x4) | New | 详细 | |
| NE5534PSR | TI | 8-SO | New | 详细 | |
| LM4852ITLX/NOPB | TI | 18-μSMD (1.97x2.23) | New | 详细 | |
| SN74LVCH245AGQNR | TI | 20-BGA MICROSTAR JUNIOR (4x3) | New | 详细 | |
| LP2998MAE/NOPB | TI | 8-SOIC | New | 详细 | |
| ADC14V155HFEB/NOPB | TI | New | 详细 | ||
| MSP430F148IRTDT | TI | 64-VQFN (9x9) | New | 详细 | |
| SN74S09DG4 | TI | 14-SOIC | New | 详细 | |
| CD74HCT40103M96 | TI | 16-SOIC | New | 详细 | |
| BQ24400PWR | TI | 8-TSSOP | New | 详细 |
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