产品系列

罗斌森
  • LM3S617-EQN50-C2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 600
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 30
    Program Memory Size : 32KB (32K x 8)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Data Converters : A/D 6x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
TLC2933AIPWG4 TI New 详细
TL750M05CKTTR TI DDPAK/TO-263-3 New 详细
DP83815DUJB/NOPB TI 160-LBGA (15x15) New 详细
LMC6041AIN TI 8-PDIP New 详细
LMX2352TM/NOPB TI 24-TSSOP New 详细
ADS58C23IPFPR TI New 详细
LM3421Q1MH/NOPB TI 16-TSSOP-EP New 详细
TPS65287RHAR TI 40-VQFN (6x6) New 详细
ISOW7842FDWER TI 16-SOIC New 详细
TLV6002IDR TI 8-SOIC New 详细
TPS62082DSGR TI 8-WSON (2x2) New 详细
TMS320DM6437ZWT7 TI 361-NFBGA (16x16) New 详细
DLPLCR6500EVM TI New 详细
SN10KHT5541DWRG4 TI 24-SOIC New 详细
SN74GTLPH16927KR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
LM2575T-12/NOPB TI TO-220-5 New 详细
OPA404SG TI 14-CDIP New 详细
LM22674QMRE-ADJ/NOPB TI 8-SO PowerPad New 详细
TMS5701225BZWTQQ1 TI 337-NFBGA (16x16) New 详细
AMC1305M25DWR TI 16-SOIC New 详细