产品系列
LM3S808-EGZ50-C2
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Stellaris? ARM? Cortex?-M3S 800
Part Status : Discontinued at Digi-Key
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : I2C, Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 28
Program Memory Size : 64KB (64K x 8)
Program Memory Type : FLASH
RAM Size : 8K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Data Converters : A/D 8x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 105°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TLV5619QDW | TI | 20-SOIC | New | 详细 | |
| LMZ10501SILEVM | TI | New | 详细 | ||
| SN74LVCH16240ADGGR | TI | 48-TSSOP | New | 详细 | |
| TPA2008D2PWP | TI | 24-HTSSOP | New | 详细 | |
| TLC542CN | TI | 20-PDIP | New | 详细 | |
| LMH0001SQE/NOPB | TI | 16-WQFN (4x4) | New | 详细 | |
| TPS54110EVM-044 | TI | New | 详细 | ||
| CD74HCT540E | TI | 20-PDIP | New | 详细 | |
| SN74AUC2G80DCURE4 | TI | New | 详细 | ||
| MAX3318CPWR | TI | 20-TSSOP | New | 详细 | |
| LP324D | TI | 14-SOIC | New | 详细 | |
| TPS78633KTTR | TI | DDPAK/TO-263-5 | New | 详细 | |
| LM3676SDX-ADJ/NOPB | TI | 8-WSON (3x3) | New | 详细 | |
| CDCLVP1208RHDR | TI | 28-VQFN (5x5) | New | 详细 | |
| MSP430F47173IPZR | TI | 100-LQFP (14x14) | New | 详细 | |
| TPA3221DDV | TI | 44-HTSSOP | New | 详细 | |
| UC2823AQ | TI | 20-PLCC (9x9) | New | 详细 | |
| TLV5627ID | TI | 16-SOIC | New | 详细 | |
| SN74ABT245BPW | TI | 20-TSSOP | New | 详细 | |
| TPS3306-33D | TI | 8-SOIC | New | 详细 |
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