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  • LM3S828-IQN50-C2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 800
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : I2C, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 28
    Program Memory Size : 64KB (64K x 8)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
SN74ABT241ADWR TI 20-SOIC New 详细
TMS320LC50PQ50 TI 132-BQFP (24.54x24.54) New 详细
TPS61100RGERG4 TI 24-VQFN (4x4) New 详细
TPS3620-33MDGKREP TI 8-VSSOP New 详细
UCC38C41P TI 8-PDIP New 详细
SN74HC4040NS TI New 详细
TL494CPW TI 16-TSSOP New 详细
TPS2032QDRQ1 TI 8-SOIC New 详细
MSP430FR60471IPZ TI 100-LQFP (14x14) New 详细
MC79L15ACLPR TI TO-92-3 New 详细
AM3358BZCZA80 TI 324-NFBGA(15x15) New 详细
BQ294682DRVT TI 6-WSON (2x2) New 详细
LM4040CIM3-3.0 TI SOT-23-3 New 详细
LP2992ILDX-1.5 TI 6-WSON (2.92x3.29) New 详细
SN74CBT3257CPWR TI 16-TSSOP New 详细
LP3992IMFX-1.5/NOPB TI SOT-23-5 New 详细
LP3965ESX-5.0 TI DDPAK/TO-263-5 New 详细
TL16C554FN TI 68-PLCC (24.23x24.23) New 详细
SN74LVC2G07YEAR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细
UCD90240ZRBR TI 157-BGA MicroStar Jr (9x9) New 详细