产品系列

罗斌森
  • LM3S828-IQN50-C2T

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 800
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : I2C, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 28
    Program Memory Size : 64KB (64K x 8)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
TLV809L30DBVT TI SOT-23-3 New 详细
REG101UA-2.5/2K5G4 TI 8-SOIC New 详细
TMS320F2802ZGMS TI 100-BGA MICROSTAR (10.1x10.1) New 详细
ADC10464CIWM/NOPB TI 28-SOIC New 详细
TCA6416PW TI 24-TSSOP New 详细
DRV2605LTDGSRQ1 TI 10-VSSOP New 详细
LM4041DIM3-ADJ/NOPB TI SOT-23-3 New 详细
TMS320VC5401GGU50 TI 144-BGA MICROSTAR (12x12) New 详细
SN74LS107ADR TI New 详细
SN74ALVC245DWR TI 20-SOIC New 详细
ADC32J25IRGZ25 TI 48-VQFN (7x7) New 详细
CY74FCT574TQCT TI New 详细
SN74V263-7GGM TI 100-BGA MICROSTAR (10.1x10.1) New 详细
ADS802U TI 28-SOIC New 详细
TMDSCNCD28069ISO TI New 详细
UC3709DW TI 16-SOIC New 详细
LP3966ES-2.5 TI DDPAK/TO-263-5 New 详细
TLV2262AQDG4 TI 8-SOIC New 详细
SN75976A1DL TI 56-SSOP New 详细
RF-HDT-DVBE-N0 TI New 详细