罗斌森
  • LMZM23600V3SILT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 4V
    Voltage - Input (Max) : 36V
    Voltage - Output 1 : 3.3V
    Current - Output (Max) : 500mA
    Applications : ITE (Commercial)
    Features : OCP, SCP, UVLO
    Operating Temperature : -40°C ~ 125°C
    Efficiency : 87%
    Mounting Type : Surface Mount
    Package / Case : 10-LDFN Exposed Pad, Module
    Size / Dimension : 0.15" L x 0.12" W x 0.06" H (3.8mm x 3.0mm x 1.6mm)
    Supplier Device Package : 10-uSIP (3.8x3)

极速报价

型号
品牌 封装 批号 查看
TLV320AIC3212EVM-U TI New 详细
SN75116DRE4 TI 16-SOIC New 详细
BQ25898CYFFR TI 42-DSBGA New 详细
LM1117MP-1.8 TI SOT-223 New 详细
TSB43AA22PDT TI 128-TQFP (14x14) New 详细
SN74ALVC244RGYR TI 20-VQFN (3.5x4.5) New 详细
LMV931MG/NOPB TI SC-70-5 New 详细
LMH6702MF/NOPB TI SOT-23-5 New 详细
CDC111FNR TI 28-PLCC (11.51x11.51) New 详细
LMK04826BEVM TI New 详细
TPS3803Q1EVM TI New 详细
LMX2336LTMX/NOPB TI 20-TSSOP New 详细
LM3S5P51-IQC80-C5 TI 100-LQFP (14x14) New 详细
SN10503PWPRG4 TI 14-HTSSOP New 详细
TLC272CD TI 8-SOIC New 详细
ISO7131CCDBQ TI 16-SSOP New 详细
SN74AS245DWRE4 TI 20-SOIC New 详细
SN74LVC125APWRG3 TI 14-TSSOP New 详细
SN74CBT3125RGYR TI 14-VQFN (3.5x3.5) New 详细
MAX3318ECDBR TI 20-SSOP New 详细