罗斌森
  • LMZM23601V3SILT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 4V
    Voltage - Input (Max) : 36V
    Voltage - Output 1 : 3.3V
    Current - Output (Max) : 1A
    Applications : ITE (Commercial)
    Features : OCP, SCP, UVLO
    Operating Temperature : -40°C ~ 125°C
    Efficiency : 81%
    Mounting Type : Surface Mount
    Package / Case : 10-LDFN Exposed Pad, Module
    Size / Dimension : 0.15" L x 0.12" W x 0.06" H (3.8mm x 3.0mm x 1.6mm)
    Supplier Device Package : 10-uSIP (3.8x3)

极速报价

型号
品牌 封装 批号 查看
LM20154MHE/NOPB TI 16-HTSSOP New 详细
UCC27321DGN TI 8-MSOP-PowerPad New 详细
TPS61099EVM-768 TI New 详细
LM3S5C31-IQC80-A1 TI 100-LQFP (14x14) New 详细
SN74LS123N TI 16-PDIP New 详细
TPS75815KTTR TI DDPAK/TO-263-5 New 详细
TMP275AID TI 8-SOIC New 详细
DP83869HMRGZT TI 48-VQFN (7x7) New 详细
SN74AUC1G74YZPR TI New 详细
SN74AUP2G04DSFR TI 6-SON (1x1) New 详细
SN74LVC1G332YZPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细
ULN2003LVDR TI 16-SOIC New 详细
LM3705XBMM-463/NOPB TI 10-VSSOP New 详细
TPS75501KTTRG3 TI DDPAK/TO-263-5 New 详细
INA1620EVM TI New 详细
LM2677S-5.0/NOPB TI DDPAK/TO-263-7 New 详细
TCAN1043GDQ1 TI 14-SOIC New 详细
CLC007BMX/NOPB TI 8-SOIC New 详细
TLV4170IDR TI 14-SOIC New 详细
AFE1105E TI 48-SSOP New 详细