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LMZM33602RLRR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Type : Non-Isolated PoL Module
Number of Outputs : 1
Voltage - Input (Min) : 4V
Voltage - Input (Max) : 36V
Voltage - Output 1 : 1 ~ 18V
Current - Output (Max) : 2A
Applications : ITE (Commercial)
Features : OCP, OTP, UVLO
Operating Temperature : -40°C ~ 105°C
Efficiency : 94%
Mounting Type : Surface Mount
Package / Case : 18-PowerBQFN Module
Size / Dimension : 0.35" L x 0.28" W x 0.16" H (9.0mm x 7.0mm x 4.1mm)
Supplier Device Package : 18-B2QFN (9x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TRF1112IRGZRG3 | TI | 48-VQFN (7x7) | New | 详细 | |
| TMS320C6674ACYP | TI | 841-FCBGA (24x24) | New | 详细 | |
| LM5107SD/NOPB | TI | 8-WSON (4x4) | New | 详细 | |
| DRV104PWPR | TI | 14-HTSSOP | New | 详细 | |
| LM3302N/NOPB | TI | 14-DIP | New | 详细 | |
| DS90C383MTD | TI | 56-TSSOP | New | 详细 | |
| SN74LVTH373PWR | TI | 20-TSSOP | New | 详细 | |
| SN74HC08QPWRG4Q1 | TI | 14-TSSOP | New | 详细 | |
| DS16EV5110ASQX/NOPB | TI | 48-WQFN (7x7) | New | 详细 | |
| MSP430F6635IZQWR | TI | 113-BGA Microstar Junior (7x7) | New | 详细 | |
| ADS62P25IRGC25 | TI | 64-VQFN (9x9) | New | 详细 | |
| TP3064BDW | TI | 20-SOIC | New | 详细 | |
| SN65LVDM320DGGG4 | TI | 64-TSSOP | New | 详细 | |
| TLV70012QDDCRQ1 | TI | SOT-23-5 | New | 详细 | |
| SN75LVDS179DRG4 | TI | 8-SOIC | New | 详细 | |
| TL750M12CKC | TI | TO-220-3 | New | 详细 | |
| LP3986BL-285285 | TI | 8-μSMD (1.57x1.57) | New | 详细 | |
| SN74LVC823ADGVR | TI | New | 详细 | ||
| BQ29704DSER | TI | New | 详细 | ||
| CD74HCT02M96 | TI | 14-SOIC | New | 详细 |
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