罗斌森
  • LMZM33606RLXR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 3.5V
    Voltage - Input (Max) : 36V
    Voltage - Output 1 : 1 ~ 20V
    Current - Output (Max) : 6A
    Applications : ITE (Commercial)
    Features : Remote On/Off, OCP, OTP, OVP, UVLO
    Operating Temperature : -40°C ~ 105°C
    Efficiency : 91%
    Mounting Type : Surface Mount
    Package / Case : 41-PowerBQFN Module
    Size / Dimension : 0.63" L x 0.39" W x 0.16" H (16.0mm x 10.0mm x 4.1mm)
    Supplier Device Package : 41-B2QFN (16x10)

极速报价

型号
品牌 封装 批号 查看
LM258DR TI 8-SOIC New 详细
SN74HC244DW TI 20-SOIC New 详细
TLV7113030DDSER TI 6-WSON (1.5x1.5) New 详细
LM7171BIM TI 8-SOIC New 详细
LM235H/NOPB TI TO-46-3 New 详细
THS4121IDR TI 8-SOIC New 详细
TPS51462RGET TI 24-VQFN (4x4) New 详细
DS14C88M TI 14-SOIC New 详细
TRSF3223IDB TI 20-SSOP New 详细
LP38693SDX-3.3 TI 6-WSON (3x3) New 详细
SN74ALS1034NSR TI 14-SOP New 详细
SN74ALVCH16501DGGR TI 56-TSSOP New 详细
DAC8562SDSCT TI 10-WSON (3x3) New 详细
BQ27500DRZR-V100G4 TI 12-SON (2.5x4) New 详细
PGA2505IDB TI 24-SSOP New 详细
SN74LVC07APWT TI 14-TSSOP New 详细
ADS8324E/250 TI 8-VSSOP New 详细
ADS8371EVM TI New 详细
MSP430F1101AIDWR TI 20-SOIC New 详细
REG1117-3.3G4 TI SOT-223-4 New 详细