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  • LMZM33606RLXR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 3.5V
    Voltage - Input (Max) : 36V
    Voltage - Output 1 : 1 ~ 20V
    Current - Output (Max) : 6A
    Applications : ITE (Commercial)
    Features : Remote On/Off, OCP, OTP, OVP, UVLO
    Operating Temperature : -40°C ~ 105°C
    Efficiency : 91%
    Mounting Type : Surface Mount
    Package / Case : 41-PowerBQFN Module
    Size / Dimension : 0.63" L x 0.39" W x 0.16" H (16.0mm x 10.0mm x 4.1mm)
    Supplier Device Package : 41-B2QFN (16x10)

极速报价

型号
品牌 封装 批号 查看
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LME49860MAX/NOPB TI 8-SOIC New 详细
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MSP430F2001TRSAT TI 16-QFN (4x4) New 详细
LP2957AIS/NOPB TI DDPAK/TO-263-5 New 详细
LM4040AIZ-3.0/NOPB TI TO-92-3 New 详细
SN74AHC1G04DBVT TI SOT-23-5 New 详细
SN74LS10DR TI 14-SOIC New 详细
XIO3130EVM TI New 详细
TPS62112RSAR TI 16-QFN (4x4) New 详细
DS34RT5110TSQE/NOPB TI 48-WQFN (7x7) New 详细
SN74ABT541BDW TI 20-SOIC New 详细
TL081ACDR TI 8-SOIC New 详细
LM2940SX-10/NOPB TI DDPAK/TO-263-3 New 详细
LM2676SD-ADJ/NOPB TI 14-VSON (5x6) New 详细
CD4017BEE4 TI 16-PDIP New 详细
SN74AHC374PWR TI New 详细
LMS1587ISX-3.3 TI DDPAK/TO-263-3 New 详细