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罗斌森
  • LMH6643MAX

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Part Status : Obsolete
    Amplifier Type : Voltage Feedback
    Number of Circuits : 2
    Output Type : Rail-to-Rail
    Slew Rate : 135V/μs
    -3db Bandwidth : 130MHz
    Current - Input Bias : 1.6μA
    Voltage - Input Offset : 1mV
    Current - Supply : 2.7mA
    Current - Output / Channel : 75mA
    Voltage - Supply, Single/Dual (±) : 2.7V ~ 12.8V, ±1.35V ~ 6.4V
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
SN74LVC3G17YZPR TI 8-DSBGA New 详细
TLV431ILPR TI TO-92-3 New 详细
TLV8542RUGR TI 8-X2QFN (1.5x1.5) New 详细
TPS3824-50DBVT TI SOT-23-5 New 详细
BQ25970EVM-893 TI New 详细
UCC38501N TI 20-PDIP New 详细
TPS7A3301KC TI TO-220-7 New 详细
LM3S2608-IBZ50-A2T TI 108-BGA (10x10) New 详细
TPS72023YZUR TI 5-DSBGA (0.96x1.33) New 详细
SN74LS375N TI 16-PDIP New 详细
AMC1311BDWVR TI 8-SOIC New 详细
CD14538BE TI 16-PDIP New 详细
TLC6C5712EVM TI New 详细
SN74CB3T3125RGYR TI 14-VQFN (3.5x3.5) New 详细
INA331AIDGKR TI 8-VSSOP New 详细
CLVTH16245AQDGGRQ1 TI 48-TSSOP New 详细
SN74ALS166DBR TI 16-SSOP New 详细
SN74LS112ADR TI New 详细
TMS320F2808ZGMA TI 100-BGA MICROSTAR (10.1x10.1) New 详细
MSP430F5257IRGCT TI 64-VQFN (9x9) New 详细