罗斌森
  • LP38788SDE-ADJ/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 12-VFDFN Exposed Pad
    Supplier Device Package : 12-WSON (4x4)

极速报价

型号
品牌 封装 批号 查看
TLV70525YFPR TI 4-DSBGA (0.8x0.8) New 详细
TPS3828-50DBVR TI SOT-23-5 New 详细
LP2902M/NOPB TI 14-SOIC New 详细
TPS73418DRVT TI 6-SON (2x2) New 详细
TPS62806YKAT TI 6-DSBGA (1.05x0.70) New 详细
INA826AIDRGR TI 8-SON (3x3) New 详细
LM2676SDX-ADJ TI 14-VSON (5x6) New 详细
TPIC1502DW TI 24-SOIC New 详细
LP3971SQE-N510/NOPB TI 40-WQFN (5x5) New 详细
SN74LVTH540NSRE4 TI 20-SO New 详细
TPS28225DR TI 8-SOIC New 详细
TPS720105YZUT TI 5-DSBGA (0.96x1.33) New 详细
UCC3808AN-1 TI 8-PDIP New 详细
ADS7881EVM TI New 详细
LM5109BQNGTTQ1 TI 8-WSON (4x4) New 详细
LM27341MY/NOPB TI 10-MSOP-PowerPad New 详细
SM32VC5510AGGWA2EP TI 240-BGA MicroStar (15x15) New 详细
TL1451CPWRG4 TI 16-TSSOP New 详细
TMS5700914APZQQ1 TI 100-LQFP (14x14) New 详细
LM2677T-ADJ/NOPB TI TO-220-7 New 详细