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LP38788SDE-ADJ/NOPB
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : *
Part Status : Active
Mounting Type : Surface Mount
Package / Case : 12-VFDFN Exposed Pad
Supplier Device Package : 12-WSON (4x4)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TIBPAL16L8-25CFN | TI | 20-PLCC (9x9) | New | 详细 | |
| TPS650732RSLR | TI | 48-VQFN (6x6) | New | 详细 | |
| BQ25600CYFFR | TI | 30-DSBGA (2.2x2.59) | New | 详细 | |
| TPS22915CYFPT | TI | 4-DSBGA | New | 详细 | |
| DS90C032BTMX | TI | 16-SOIC | New | 详细 | |
| TLVH431BQDBZT | TI | SOT-23-3 | New | 详细 | |
| SN74LVC74ADBR | TI | New | 详细 | ||
| LM236AH-2.5/NOPB | TI | TO-46-3 | New | 详细 | |
| LMC6482IN | TI | 8-PDIP | New | 详细 | |
| DRV8837CEVM | TI | New | 详细 | ||
| SN74HC11PWTE4 | TI | 14-TSSOP | New | 详细 | |
| SN74HC166NS | TI | New | 详细 | ||
| BQ29716DSET | TI | 6-WSON (1.5x1.5) | New | 详细 | |
| MSP430F5436IPZ | TI | 100-LQFP (14x14) | New | 详细 | |
| CD74HC423M96 | TI | 16-SOIC | New | 详细 | |
| LM3658SD/NOPB | TI | 10-WSON (3x3) | New | 详细 | |
| LMP8671MAX/NOPB | TI | 8-SOIC | New | 详细 | |
| BQ25600CYFFT | TI | 30-DSBGA | New | 详细 | |
| CDC950DGGG4 | TI | 48-TSSOP | New | 详细 | |
| LM4040BIM3X-8.2 | TI | SOT-23-3 | New | 详细 |
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