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  • MSP430F122IRHBR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430x1xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 8MHz
    Connectivity : SPI, UART/USART
    Peripherals : POR, PWM, WDT
    Number of I/O : 22
    Program Memory Size : 4KB (4K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : Slope A/D
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 32-VFQFN Exposed Pad
    Supplier Device Package : 32-VQFN (5x5)

极速报价

型号
品牌 封装 批号 查看
LMX2531LQ2294/NOPB TI 36-WQFN (6x6) New 详细
TLV2711CDBVT TI SOT-23-5 New 详细
UCC2819APWR TI 16-TSSOP New 详细
TMP302ADRLT TI 6-SOT New 详细
SN65HVD07DR TI 8-SOIC New 详细
LM4040DEM3-2.5 TI SOT-23-3 New 详细
DBB03IPMR TI 64-LQFP (10x10) New 详细
TRF3705IRGER TI New 详细
PCF8574RGYR TI 20-VQFN (3.5x4.5) New 详细
SN74LVTH322374KR TI New 详细
LM4040C25IDCKR TI SC-70-5 New 详细
PCM1865DBTR TI 30-TSSOP New 详细
TLV1117-33CDCYR TI SOT-223-4 New 详细
SN75LBC180RSARG4 TI 16-QFN (4x4) New 详细
LP2989AIMMX-2.5/NOPB TI 8-VSSOP New 详细
MSP430FR2110IRLLT TI 24-VQFN (3x3) New 详细
TPS76818QPWP TI 20-HTSSOP New 详细
TPS78625KTTT TI DDPAK/TO-263-5 New 详细
BQ4010YMA-70 TI 28-DIP Module (18.42x37.72) New 详细
SN65MLVD3DRBT TI 8-SON (3x3) New 详细