产品系列

罗斌森
  • MSP430F123IDW

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Series : MSP430x1xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 8MHz
    Connectivity : SPI, UART/USART
    Peripherals : POR, PWM, WDT
    Number of I/O : 22
    Program Memory Size : 8KB (8K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : Slope A/D
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 28-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 28-SOIC

极速报价

型号
品牌 封装 批号 查看
TPS71433DRVR TI 6-SON (2x2) New 详细
PCA9546ADR TI 16-SOIC New 详细
SN74CBT16390DGVR TI 56-TVSOP New 详细
TPS2051BDR TI 8-SOIC New 详细
ICL7135CN TI 28-PDIP New 详细
LM336BM-5.0 TI 8-SOIC New 详细
MSP432P401MIRGCR TI 64-VQFN (9x9) New 详细
PTMA401120P1AD TI New 详细
THS4211DGN TI 8-MSOP-PowerPad New 详细
TLC7524ID TI 16-SOIC New 详细
TLC7524CD TI 16-SOIC New 详细
SM320C6701GJCA12EP TI 352-FC/CSP (35x35) New 详细
LP3985ITL-3.1/NOPB TI 5-DSBGA (1.41x1.08) New 详细
BQ7790503PW TI 20-TSSOP New 详细
TPS650531RGER TI 24-VQFN (4x4) New 详细
LM3S3Z26-IQR50-C3 TI 64-LQFP (10x10) New 详细
MSP430G2544IYFFT TI 49-DSBGA (2.8x2.8) New 详细
LP55271TLX/NOPB TI 30-TuSMD New 详细
TLV5632IPW TI 20-TSSOP New 详细
THS3122ID TI 8-SOIC New 详细