产品系列

罗斌森
  • MSP430F248TRGCR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 48
    Program Memory Size : 48KB (48K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 4K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
TPS62205DBVT TI SOT-23-5 New 详细
LM6211MF/NOPB TI SOT-23-5 New 详细
SN74F02DR TI 14-SOIC New 详细
ADC08832IMMX TI 8-VSSOP New 详细
TLV2370IP TI 8-PDIP New 详细
THS6042IDR TI 8-SOIC New 详细
LM337KTTRG3 TI DDPAK/TO-263-3 New 详细
REF02BU TI 8-SOIC New 详细
LM3S3N26-IQR50-C0 TI 64-LQFP (10x10) New 详细
LMV105M5X TI SOT-23-5 New 详细
TAS5121IDKD TI 36-HSSOP New 详细
MAX232DG4 TI 16-SOIC New 详细
ADS8354IPWR TI 16-TSSOP New 详细
TMS320F2809PZS TI 100-LQFP (14x14) New 详细
BQ24715RGRT TI 20-VQFN (3.5x3.5) New 详细
LP3964ES-1.8 TI DDPAK/TO-263-5 New 详细
SN74ABT8652DWRE4 TI 28-SOIC New 详细
PCM54JP TI 28-DIP New 详细
LM2577S-12 TI DDPAK/TO-263-5 New 详细
SN74HC125D TI 14-SOIC New 详细