产品系列

罗斌森
  • MSP430F2491TRGCR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 48
    Program Memory Size : 60KB (60K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 2K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
LM5111-2MYX TI 8-MSOP-PowerPad New 详细
SN74LVC8T245MDWREP TI 24-SOIC New 详细
LM22678QTJE-5.0/NOPB TI TO-263-7 Thin New 详细
CD74HC147E TI 16-PDIP New 详细
MCP810M3-4.38/NOPB TI SOT-23-3 New 详细
SN65EPT22DGK TI 8-VSSOP New 详细
LM3S9781-IBZ80-C3T TI 108-BGA (10x10) New 详细
LP5912-3.0DRVT TI 6-WSON (2x2) New 详细
SN74AHC74PWR TI New 详细
UCC28600DR TI 8-SOIC New 详细
74ACT11257NSR TI 20-SO New 详细
TSC2003IZQCR TI 48-BGA MICROSTAR JUNIOR (4x4) New 详细
UA7915CKTER TI 3-PowerFLEX? New 详细
CC1120EMK-868-915 TI New 详细
SN74LVC1G00DCKT TI SC-70-5 New 详细
REF3425IDBVR TI SOT-23-6 New 详细
DAC102S085CISDX TI 10-WSON (3x3) New 详细
TLV2473IDGQ TI 10-MSOP-PowerPad New 详细
PCM1864DBTR TI 30-TSSOP New 详细
LP8725TLE-D/NOPB TI 30-DSBGA New 详细