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  • MSP430F2491TRGCR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 48
    Program Memory Size : 60KB (60K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 2K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
SN74AHC594DBR TI 16-SSOP New 详细
TPS2055DR TI 8-SOIC New 详细
DRV8702DQRHBRQ1 TI 32-VQFN (5x5) New 详细
LM4050AEM3-8.2/NOPB TI SOT-23-3 New 详细
LM4040AIM3-2.0 TI SOT-23-3 New 详细
INA202AID TI 8-SOIC New 详细
LM2594HVMX-12 TI 8-SOIC New 详细
PCM2912PJT TI 32-TQFP (7x7) New 详细
LM43603DSUT TI 16-SON (5.1x4.1) New 详细
LMZ30604RKGT TI 39-B1QFN (11x9) New 详细
LM1971M TI New 详细
TPS2812DR TI 8-SOIC New 详细
TS3USB221AQRSERQ1 TI 10-UQFN (2.0x1.5) New 详细
TLV73318PDQNR3 TI 4-X2SON (1x1) New 详细
ADS8382IRHPR TI 28-VQFN-EP (6x6) New 详细
TMS320C5535AZHHA10 TI 144-BGA MICROSTAR (12x12) New 详细
TLV272CDGK TI 8-VSSOP New 详细
OPA1688IDRGR TI 8-SON (3x3) New 详细
LP2981IBP-3.2/NOPB TI 5-μSMD (0.93x1.11) New 详细
LM3S1B21-IQC80-C5T TI 100-LQFP (14x14) New 详细