产品系列

罗斌森
  • MSP430F249MPMEP

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 48
    Program Memory Size : 60KB (60K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 2K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x12b
    Oscillator Type : Internal
    Operating Temperature : -55°C ~ 125°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-LQFP
    Supplier Device Package : 64-LQFP (10x10)

极速报价

型号
品牌 封装 批号 查看
LMV1015XR-15/NOPB TI 4-DSBGA New 详细
TPS75218QPWP TI 20-HTSSOP New 详细
AM3354BZCZA60 TI 324-NFBGA(15x15) New 详细
SN74AHCU04RGYR TI 14-VQFN (3.5x3.5) New 详细
LM2592HVSX-ADJ/NOPB TI DDPAK/TO-263-5 New 详细
TLV2217-33KCE3 TI TO-220-3 New 详细
LP2985AIM5X-2.5 TI SOT-23-5 New 详细
ADS1261BIRHBT TI 32-VQFN (5x5) New 详细
LM2671M-3.3 TI 8-SOIC New 详细
CDCE62005RGZT TI 48-VQFN (7x7) New 详细
CY74FCT157CTSOC TI 16-SOIC New 详细
LM2599SX-5.0/NOPB TI DDPAK/TO-263-7 New 详细
MSP430G2102IN20 TI 20-PDIP New 详细
TPS3307-33DGN TI 8-MSOP-PowerPad New 详细
LM5033MMX/NOPB TI 10-VSSOP New 详细
TPS55165QPWPRQ1 TI 20-HTSSOP New 详细
LF444CM/NOPB TI 14-SOIC New 详细
SN74LVC1G10DCKRG4 TI New 详细
LMR16006YDDCR TI TSOT-23-6 New 详细
SN74LS14DBR TI 14-SSOP New 详细