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  • MSP430F2617TPM

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 48
    Program Memory Size : 92KB (92K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x12b; D/A 2x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-LQFP
    Supplier Device Package : 64-LQFP (10x10)

极速报价

型号
品牌 封装 批号 查看
SN74AUP3G17YFPR TI 8-DSBGA (1.6x0.8) New 详细
LM3658SD-A/NOPB TI 10-WSON (3x3) New 详细
TLC25L2CPW TI 8-TSSOP New 详细
LM3S3J26-IQR50-C5 TI 64-LQFP (10x10) New 详细
TPS77018DBVR TI SOT-23-5 New 详细
LM2587SX-5.0/NOPB TI DDPAK/TO-263-5 New 详细
CP3BT23Y98AWM/NOPB TI 144-LQFP (20x20) New 详细
TIBPAL16L8-15CFN TI 20-PLCC (9x9) New 详细
MAX232DR TI 16-SOIC New 详细
ADC128S052CIMTX/NOPB TI 16-TSSOP New 详细
LM336M-2.5/NOPB TI 8-SOIC New 详细
LM3880QMF-1AE/NOPB TI SOT-23-6 New 详细
PCM56P-J TI 16-PDIP New 详细
SCANSTA111MT TI 48-TSSOP New 详细
LM10CWM/NOPB TI 14-SOIC New 详细
SN74LVC2G08YEPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
DCP010507DBP-UE4 TI New 详细
LMV932Q1MAX/NOPB TI 8-SOIC New 详细
LMX2364SLEX/NOPB TI 24-ULGA (4.5x3.5) New 详细
LM2795TL TI 14-μSMD (2.1x2.4) New 详细