产品系列
MSP430F2618TPNR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F2xx
Part Status : Active
Core Processor : MSP430
Core Size : 16-Bit
Speed : 16MHz
Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 116KB (116K x 8 + 256B)
Program Memory Type : FLASH
RAM Size : 8K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 8x12b; D/A 2x12b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 105°C (TA)
Mounting Type : Surface Mount
Package / Case : 80-LQFP
Supplier Device Package : 80-LQFP (12x12)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74HC27DR | TI | 14-SOIC | New | 详细 | |
| THVD1550DGK | TI | 8-VSSOP | New | 详细 | |
| TPS62133RGTR | TI | 16-QFN (3x3) | New | 详细 | |
| SN74LV244ATPWT | TI | 20-TSSOP | New | 详细 | |
| SN74S132D | TI | 14-SOIC | New | 详细 | |
| MSP430G2402IPW14 | TI | 14-TSSOP | New | 详细 | |
| TPS77633PWP | TI | 20-HTSSOP | New | 详细 | |
| TMS320C6727BGDH300 | TI | 256-BGA (17x17) | New | 详细 | |
| LP3981ILDX-2.5 | TI | 6-WSON (3x4) | New | 详细 | |
| TLV7081YKAR | TI | 4-DSBGA (0.70x0.70) | New | 详细 | |
| OPA2677T | TI | 16-SO | New | 详细 | |
| LM27402SQEVAL/NOPB | TI | New | 详细 | ||
| UCC2808AN-1 | TI | 8-PDIP | New | 详细 | |
| AM5706BCBDJ | TI | 538-FCBGA (17x17) | New | 详细 | |
| MAX3221IPWRG4 | TI | 16-TSSOP | New | 详细 | |
| LM3S800-EGZ50-C2T | TI | 48-VQFN (7x7) | New | 详细 | |
| BQ24093DGQR | TI | 10-MSOP-PowerPad | New | 详细 | |
| TLV803ZDBZR | TI | SOT-23-3 | New | 详细 | |
| SN10KHT5542DWE4 | TI | 24-SOIC | New | 详细 | |
| LM3670MF-1.6 | TI | SOT-23-5 | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com