产品系列

罗斌森
  • OMAPL137CZKB3

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : OMAP-L1x
    Part Status : Obsolete
    Core Processor : ARM926EJ-S
    Number of Cores/Bus Width : 1 Core, 32-Bit
    Speed : 375MHz
    Co-Processors/DSP : Signal Processing; C674x, System Control; CP15
    RAM Controllers : SDRAM
    Graphics Acceleration : No
    Display & Interface Controllers : LCD
    Ethernet : 10/100 Mbps (1)
    USB : USB 1.1 + PHY (1), USB 2.0 + PHY (1)
    Voltage - I/O : 1.8V, 3.3V
    Operating Temperature : 0°C ~ 90°C (TJ)
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

极速报价

型号
品牌 封装 批号 查看
INA148UA/2K5 TI 8-SOIC New 详细
UCD90160RGCT TI 64-VQFN (9x9) New 详细
SN74LVC4245ADWRG4 TI 24-SOIC New 详细
DS90C387VJD/NOPB TI 100-TQFP (14x14) New 详细
TPS77715DR TI 8-SOIC New 详细
MAX3232EIPW TI 16-TSSOP New 详细
SN74ABT853NSR TI 24-SO New 详细
BQ296106DSGR TI New 详细
TLC251CD TI 8-SOIC New 详细
TLV5630IDWR TI 20-SOIC New 详细
UCC2917DTRG4 TI 16-SOIC New 详细
SM320C6748EGWTS3 TI 361-NFBGA (16x16) New 详细
SN74AUP3G07DCUR TI US8 New 详细
TPS61103PW TI 20-TSSOP New 详细
SN74ABT162601DGG TI 56-TSSOP New 详细
SN74LVC1G125YEPR TI 5-DSBGA, 5-WCSP (1.4x0.9) New 详细
TLV320A1109PBSRG4 TI 32-TQFP (5x5) New 详细
SN74CBTLV3257PW TI 16-TSSOP New 详细
LM5069MM-2/NOPB TI 10-VSSOP New 详细
TPA2100P1YZHT TI 16-DSBGA (2.24x2.16) New 详细