产品系列

罗斌森
  • OMAPL137DZKB3

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : OMAP-L1x
    Part Status : Active
    Core Processor : ARM926EJ-S
    Number of Cores/Bus Width : 1 Core, 32-Bit
    Speed : 375MHz
    Co-Processors/DSP : Signal Processing; C674x, System Control; CP15
    RAM Controllers : SDRAM
    Graphics Acceleration : No
    Display & Interface Controllers : LCD
    Ethernet : 10/100 Mbps (1)
    USB : USB 1.1 + PHY (1), USB 2.0 + PHY (1)
    Voltage - I/O : 1.8V, 3.3V
    Operating Temperature : 0°C ~ 90°C (TJ)
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

极速报价

型号
品牌 封装 批号 查看
ADS1100A7IDBVR TI SOT-23-6 New 详细
SN74LVC1G08DBVRG4 TI SOT-23-5 New 详细
TMS370C712AFNT TI 28-PLCC (11.51x11.51) New 详细
PTH12050YAZ TI New 详细
TMP102AIDRLR TI SOT-563 New 详细
LMP2022MA/NOPB TI 8-SOIC New 详细
TPS77118DGKR TI 8-VSSOP New 详细
SN74AUP1G57YZPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细
LP38852S-ADJ TI DDPAK/TO-263-7 New 详细
LM61CIZ TI TO-92-3 New 详细
LMR14006YDDCT TI TSOT-23-6 New 详细
LM4132BMF-3.0 TI SOT-23-5 New 详细
LM20125MHX/NOPB TI 16-HTSSOP New 详细
LM2937IMP-12 TI SOT-223-4 New 详细
SN74LVTH573PW TI 20-TSSOP New 详细
TPS613221ADBVR TI SOT-23-5 New 详细
TPD7S019-15DBQR TI 16-SSOP New 详细
SN65LBC179DR TI 8-SOIC New 详细
LM1851N TI 8-PDIP New 详细
LM3S9B96-IBZ80-C5T TI 108-BGA (10x10) New 详细