产品系列

罗斌森
  • MSP430F155IRTDT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430x1xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 8MHz
    Connectivity : I2C, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 48
    Program Memory Size : 16KB (16K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 512 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x12b; D/A 2x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
SN74ABT377AN TI New 详细
LP3873ES-3.3/NOPB TI DDPAK/TO-263-5 New 详细
LMX2531LQX2220E/NOPB TI 36-WQFN (6x6) New 详细
SN75LBC179AP TI 8-PDIP New 详细
LM3S1138-EQC50-A2T TI 100-LQFP (14x14) New 详细
TL4050C50QDBZR TI SOT-23-3 New 详细
LM4040CIM3X-2.5 TI SOT-23-3 New 详细
LM611CM TI 14-SOIC New 详细
LM5045SQX/NOPB TI New 详细
AFE5801EVM TI New 详细
LPV358IDGKR TI 8-VSSOP New 详细
LM2930S-5.0/NOPB TI DDPAK/TO-263-3 New 详细
TLE2062CD TI 8-SOIC New 详细
SN74BCT8244ADW TI 24-SOIC New 详细
TLC2254QDREP TI 14-SOIC New 详细
LP5912-1.0DRVR TI 6-WSON (2x2) New 详细
TPS5410D TI 8-SOIC New 详细
WL1831MODGBMOCT TI New 详细
CD74AC14M TI 14-SOIC New 详细
THS4302EVM TI New 详细