产品系列
MSP430F2003TRSAR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F2xx
Part Status : Active
Core Processor : MSP430
Core Size : 16-Bit
Speed : 16MHz
Connectivity : I2C, SPI
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 10
Program Memory Size : 1KB (1K x 8 + 256B)
Program Memory Type : FLASH
RAM Size : 128 x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 10x16b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 105°C (TA)
Mounting Type : Surface Mount
Package / Case : 16-VQFN Exposed Pad
Supplier Device Package : 16-QFN (4x4)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LMH6704MA | TI | 8-SOIC | New | 详细 | |
| TNETV6446AINZWT | TI | 361-NFBGA (16x16) | New | 详细 | |
| LMV612MM/NOPB | TI | 8-VSSOP | New | 详细 | |
| SN74LVC2GU04YZAR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| UCC3580N-4G4 | TI | 16-PDIP | New | 详细 | |
| LM3S1621-IQC80-C5 | TI | 100-LQFP (14x14) | New | 详细 | |
| ADS7818P | TI | 8-PDIP | New | 详细 | |
| UC3909DWG4 | TI | 20-SOIC | New | 详细 | |
| SN74LVC1G132YEPR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 详细 | |
| THS7373EVM | TI | New | 详细 | ||
| LP8860EQVFPRQ1 | TI | 32-HLQFP (7x7) | New | 详细 | |
| SN74AS640DWE4 | TI | 20-SOIC | New | 详细 | |
| INA381A1IDSGR | TI | New | 详细 | ||
| TPS651851RSLR | TI | 48-VQFN (6x6) | New | 详细 | |
| BQ4852YMC-85 | TI | 36-DIP Module (18.42x52.96) | New | 详细 | |
| TPS73001DBVR | TI | SOT-23-6 | New | 详细 | |
| UCC2813DTR-3 | TI | 8-SOIC | New | 详细 | |
| INA216A1YFFT | TI | 4-DSBGA (1x1) | New | 详细 | |
| MSP430F427IPMR | TI | 64-LQFP (10x10) | New | 详细 | |
| CD74HC75PWR | TI | 16-TSSOP | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com