产品系列
MSP430F2013IRSAR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F2xx
Part Status : Active
Core Processor : MSP430
Core Size : 16-Bit
Speed : 16MHz
Connectivity : I2C, SPI
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 10
Program Memory Size : 2KB (2K x 8 + 256B)
Program Memory Type : FLASH
RAM Size : 128 x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 10x16b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 16-VQFN Exposed Pad
Supplier Device Package : 16-QFN (4x4)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| DRV110EVM | TI | New | 详细 | ||
| TM4C1294KCPDTI3R | TI | 128-TQFP (14x14) | New | 详细 | |
| LM5050Q0MKX-1/NOPB | TI | SOT-23-6 | New | 详细 | |
| LM3671MFX-ADJ | TI | SOT-23-5 | New | 详细 | |
| SN74AHCT157PW | TI | 16-TSSOP | New | 详细 | |
| BQ77908AEVM-001 | TI | New | 详细 | ||
| SN74AUC00RGYR | TI | 14-VQFN (3.5x3.5) | New | 详细 | |
| LM3153MHE-3.3/NOPB | TI | 14-HTSSOP | New | 详细 | |
| UCC3913DTRG4 | TI | 8-SOIC | New | 详细 | |
| INA202AQDGKRQ1 | TI | 8-VSSOP | New | 详细 | |
| OPA2171AIDGKR | TI | 8-VSSOP | New | 详细 | |
| LP3852ES-3.3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TMS320F241PG | TI | 64-QFP (14x20) | New | 详细 | |
| X66AK2H12AAAW2 | TI | 1517-FCBGA (40x40) | New | 详细 | |
| SN74LVC2244APWR | TI | 20-TSSOP | New | 详细 | |
| LMC6042IM/NOPB | TI | 8-SOIC | New | 详细 | |
| TPS61163YFFR | TI | 9-DSBGA | New | 详细 | |
| LM3S818-IGZ50-C2T | TI | 48-VQFN (7x7) | New | 详细 | |
| SN74S374NSRG4 | TI | New | 详细 | ||
| LP3965ES-5.0/NOPB | TI | DDPAK/TO-263-5 | New | 详细 |
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