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  • MSP430F2013IRSAT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, SPI
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 10
    Program Memory Size : 2KB (2K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 128 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 10x16b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 16-VQFN Exposed Pad
    Supplier Device Package : 16-QFN (4x4)

极速报价

型号
品牌 封装 批号 查看
LM5101BSD/NOPB TI 10-WSON (4x4) New 详细
LM285MX-2.5/NOPB TI 8-SOIC New 详细
LP5907QMFX-3.0Q1 TI SOT-23-5 New 详细
TMP75CQDGKRQ1 TI 8-VSSOP New 详细
LM358LVIDR TI 8-SOIC New 详细
CY74FCT543ATQCT TI 24-SSOP/QSOP New 详细
LP3856ES-1.8 TI DDPAK/TO-263-5 New 详细
LP5907UVX-2.85/NOPB TI 4-DSBGA New 详细
LM3704YCMMX-232 TI 10-VSSOP New 详细
CC1111F32RSPR TI New 详细
LP2989AIMMX-3.3/NOPB TI 8-VSSOP New 详细
DRV5053VAELPGMQ1 TI TO-92-3 New 详细
LM3668SD-4550EV TI New 详细
OPA4196ID TI 14-SOIC New 详细
74LVC1GX04DCKTG4 TI New 详细
LP2981AIM5-2.5 TI SOT-23-5 New 详细
LP5907UVX37/NOPB TI 4-DSBGA New 详细
LM317H TI TO-39-3 New 详细
78ST115HC TI New 详细
TLV1117-18CKVURG3 TI TO-252-3 New 详细