产品系列

罗斌森
  • MSP430F2111TDGV

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Not For New Designs
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 16
    Program Memory Size : 2KB (2K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 128 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : Slope A/D
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 20-TFSOP (0.173", 4.40mm Width)
    Supplier Device Package : 20-TVSOP

极速报价

型号
品牌 封装 批号 查看
TLC339CNS TI 14-SOP New 详细
UC3846DW TI 16-SOIC New 详细
SN74AVC16245DGVR TI 48-TVSOP New 详细
EDSTRG28PLCC02 TI New 详细
ADS8588HIPM TI 64-LQFP (10x10) New 详细
TPS3306-18DGK TI 8-VSSOP New 详细
TPS75501KC TI TO-220-5 New 详细
MAX232ECDR TI 16-SOIC New 详细
SN74AVC2T244DQER TI 8-X2SON (1.4x1.0) New 详细
TPS549B22EVM-847 TI New 详细
TMS320C6748EZWT3 TI 361-NFBGA (16x16) New 详细
LM2770SDX-12157/NOPB TI 10-SON (3x3) New 详细
TPS82740BSIPT TI 9-USIP New 详细
TPS92510EVM-011 TI New 详细
LM3S6C11-IBZ80-A1T TI 108-BGA (10x10) New 详细
UCC38503DW TI 20-SOIC New 详细
TPS53219ARGTT TI 16-QFN (3x3) New 详细
SN74LS465DWR TI 20-SOIC New 详细
MSP-FET430U80 TI New 详细
BQ2013HEVM-001 TI New 详细