产品系列
MSP430F2131IPW
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Series : MSP430F2xx
Part Status : Active
Core Processor : MSP430
Core Size : 16-Bit
Speed : 16MHz
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 16
Program Memory Size : 8KB (8K x 8 + 256B)
Program Memory Type : FLASH
RAM Size : 256 x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : Slope A/D
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package : 20-TSSOP
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| ADC0838CIWM/NOPB | TI | 20-SOIC | New | 详细 | |
| LP3995ILD-1.8 | TI | 6-WSON (2.92x3.29) | New | 详细 | |
| TLK10031CTR | TI | 144-FCBGA (13x13) | New | 详细 | |
| MSP430G2001IPW14R | TI | 14-TSSOP | New | 详细 | |
| LM3754EVAL/NOPB | TI | New | 详细 | ||
| OPA320AQDBVRQ1 | TI | SOT-23-5 | New | 详细 | |
| CDC2586PAH | TI | 52-TQFP (10x10) | New | 详细 | |
| MSP432P401MIRGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| CD74FCT245M96 | TI | 20-SOIC | New | 详细 | |
| LP3966ES-ADJ/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| TMDSCCS-ALLF03 | TI | New | 详细 | ||
| LM2676S-12/NOPB | TI | DDPAK/TO-263-7 | New | 详细 | |
| LM3S1D26-IQR80-A2T | TI | 64-LQFP (10x10) | New | 详细 | |
| TPS650242RHBT | TI | 32-VQFN (5x5) | New | 详细 | |
| LP2981-28DBVTE4 | TI | SOT-23-5 | New | 详细 | |
| LM26CIM5-TPA | TI | SOT-23-5 | New | 详细 | |
| SN74ALVC164245DL | TI | 48-SSOP | New | 详细 | |
| TM4C123GH6PZI7 | TI | 100-LQFP (14x14) | New | 详细 | |
| LMH6732MAX | TI | 8-SOIC | New | 详细 | |
| LM26480QSQX-8D/NOPB | TI | 24-WQFN (4x4) | New | 详细 |
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