产品系列
MSP430F2272IYFFR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F2xx
Part Status : Active
Core Processor : MSP430
Core Size : 16-Bit
Speed : 16MHz
Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 32
Program Memory Size : 32KB (32K x 8 + 256B)
Program Memory Type : FLASH
RAM Size : 1K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 12x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 49-UFBGA, DSBGA
Supplier Device Package : 49-DSBGA (2.8x2.8)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
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| TL2575-15IKTTR | TI | DDPAK/TO-263-5 | New | 详细 | |
| SN74HC574NG4 | TI | New | 详细 | ||
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| TLV2252ID | TI | 8-SOIC | New | 详细 | |
| SN74S1053DBR | TI | 20-SSOP | New | 详细 | |
| SN74AHCT273NSR | TI | New | 详细 | ||
| SN75C23243DGGR | TI | 48-TSSOP | New | 详细 | |
| REF3430IDBVR | TI | SOT-23-6 | New | 详细 | |
| LP3853ESX-3.3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| PCI1520IGHKEP | TI | 209-PBGA (16x16) | New | 详细 | |
| LMC6062IN/NOPB | TI | 8-PDIP | New | 详细 | |
| LM2574HVMX-3.3 | TI | 14-SOIC | New | 详细 | |
| TRSF3232ECDBR | TI | 16-SSOP | New | 详细 | |
| CY74FCT157ATSOCTE4 | TI | 16-SOIC | New | 详细 | |
| PCM2704DBR | TI | 28-SSOP | New | 详细 | |
| LP3876ESX-ADJ/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| PT4144A | TI | New | 详细 |
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